- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices having separate containers
Patent holdings for IPC class H01L 25/10
Total number of patents in this class: 3252
10-year publication summary
296
|
312
|
277
|
337
|
314
|
304
|
226
|
263
|
291
|
143
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
912 |
Samsung Electronics Co., Ltd. | 131630 |
464 |
Intel Corporation | 45621 |
147 |
STATS ChipPAC Pte. Lte. | 1516 |
112 |
Invensas Corporation | 645 |
98 |
Micron Technology, Inc. | 24960 |
82 |
Qualcomm Incorporated | 76576 |
75 |
Tessera, Inc. | 667 |
57 |
Jcet Semiconductor (shaoxing) Co., Ltd. | 366 |
52 |
Murata Manufacturing Co., Ltd. | 22355 |
51 |
Mediatek Inc. | 4584 |
51 |
Amkor Technology Singapore Holding Pte. Ltd | 314 |
43 |
Siliconware Precision Industries Co., Ltd. | 489 |
42 |
Advanced Semiconductor Engineering, Inc. | 1546 |
37 |
Apple Inc. | 50209 |
36 |
Shinko Electric Industries Co., Ltd. | 1186 |
33 |
Rambus Inc. | 2314 |
27 |
Amkor Technology Singapore Holding Pte.ltd. | 555 |
20 |
Invensas LLC | 95 |
20 |
Infineon Technologies AG | 8189 |
18 |
Other owners | 875 |